LTCC微波组件层压工艺综合应力仿真分析

摘要

In order to improve the mechanical properties of LTCC microwave component,the 3D finite element simulation a-nalysis model of LTCC microwave component is constructed by ANSYS software,the lamination process simulation chooses three process parameters like the pressure,pressure time and temperature to analyze the stress distribution and comprehen-sive stress change rule in the process of lamination.The research shows that the stress has the most significant influence, pressure time has less influence and temperature is the least significant influence factor.A set of reasonable lamination process parameters are obtained by simulation analysis:the pressure is 21 MPa,the pressure time is 16 min,the tempera-ture is 70 ℃,which can avoid the stress concentration phenomenon effectively,and improve the mechanical performance of microwave component.%为了改善LTCC微波组件的机械性能,采用ANSYS软件建立LTCC微波组件的三维有限元仿真分析模型,选择对层压工艺影响较大的压力、层压时间和温度3个工艺参数,对LTCC层压工艺进行热-结构耦合有限元仿真,分析微波组件层压过程中的应力分布情况及综合应力.分析结果表明,层压工艺参数对综合应力影响为:压力影响最显著,时间次之,温度影响较小.通过仿真分析得到合理的层压工艺参数为压力21 MPa、时间16 min和温度70℃,可以避免应力集中现象,提高LTCC微波组件的机械性能.