相变温控是利用相变材料的相变过程以实现对物体温度控制的方法.以高热导率和储热密度的膨胀石墨/石蜡复合材料制作储热材料器件,构建了基于相变温控的电子器件散热模拟实验系统.研究在3种波动热负荷条件下,模拟芯片的表面温度随时间的变化情况,并与同型号传统散热器比较,分析相变温控对电子器件瞬态热管理的影响规律.实验结果表明,在同等条件下,相变温控散热实验系统的抗热冲击性能约为传统散热系统的1.4倍.将复合相变材料应用于电子器件的瞬态热管理中,可以降低电子设备的表面温度、减小温度波动幅度,保证电子电器设备运行的可靠性和稳定性.%Phase-change thermal control is a promising method that uses phase change of phase change materials (PCM) to control subject temperature. Expanded graphite/paraffin composite PCM with excellent thermal conductivity and heat storage capacity was applied to prepare a heat storage unit, which was integrated into an electronic cooling experimental system. The surface temperature variation of simulative chips as a function of time was investigated under three workloads. The results were compared with traditional cooling systems to investigate the effect of phase-change thermal control on transient thermal management of electronic components. The experimental results show that the heat shock resistance of the new cooling system is 1.4 times better than the traditional cooling system under same experimental conditions. The composite PCM in transient thermal management can effectively reduce surface temperature and temperature fluctuation of electronic components, which ensures operational reliability and stability.
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