几种电子陶瓷材料的研究进展与应用前景

摘要

The rapid integration and miniaturization of electronics demands that electronic products be high-speed,micro-thin and highly reliable.The core materials of the electronic components are functional ceramics with specific electric,magnetic,acoustic,optical,thermal and mechanical characteristics.The development trends of functional ceramic components are multi-layer,chip-based,integrated,modular and multi-functional,high-performance and low-cost.In the paper,the microwave dielectric,ferroelectric,piezoelectric,ferromagnetic,pyroelectric and pressure-sensitive ceramics are introduced.At the same time,the latest research progress and the possible application prospect are also introduced.%电子科学,信息技术发展日新月异,高速奔向集成化和微型化.在电子产品中,元器件是其重要的组件之一.所以对核心元件提出更高的标准:必须具有高速,微型,轻薄,高可靠性等特点.电子元器件的核心技术就是如何利用功能陶瓷材料的电、磁、声、光、力、热等特性.元器件的发展趋势是小型化、片式化、多层化、模块化、集成化和多功能化,以及高性能低花费,方便使用.本文综合介绍了微波介电,铁电压电,磁性以及热释电等新型功能陶瓷材料,同时也介绍了最新的研究进展及可能的应用前景.