Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;
Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;
Queen Mary University of London Engineering School Northwestern Polytechnical University Xi’an 710119 China;
Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;
School of Packaging and Materials Engineering Hunan University of Technology Zhuzhou 412007 China;
Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;
Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;
School of Packaging and Materials Engineering Hunan University of Technology Zhuzhou 412007 China;
Frontiers Science Center for Flexible Electronics(FSCFE)and X i’an Institute of Flexible Electronics(IFE) Northwestern Polytechnical University Xi’an 710072 China;