阴极组件用Ru-V高温粉末钎料的制备及性能研究

摘要

The selection and preparation of the ruthenium-vanadium alloy solder powder, welding technology tests and cathode weldment’s evaporation experiments in vacuum condiction at 1000~1200℃, etc. , were studied. The results showed that the selected ruthenium-vanadium superalloy met the brazing temperature requirements of vacuum electronic devices. This spherical powder solder of ruthenium-vanadium alloy was completely wetting, the wettability and spreadability were very good on base metal W and Mo. Cathode W/Mo welding pieces had any evaporation in vacuum condition at 1000~1200 ℃, met the requirements of the production process.%通过对Ru-V合金粉末钎料选择与制备,焊接工艺性能试验及在1000~1200℃真空条件下阴极焊接件的蒸发试验等研究,结果表明,所选的Ru-V合金钎料满足了真空电子器件阴极的焊接温度要求； Ru-V合金球形粉末在母材W, Mo上的润湿、铺展性能非常好,能完全润湿母材；阴极W/Mo焊接件在1000~1200℃的真空条件下无蒸发物出现,满足了生产工艺要求。