AZ4620光刻胶的喷雾式涂胶工艺

摘要

For several MEMS applications,pattern transfer on wafers with extensive topography requires a uniform resist layer over a nonplanar surface.Spray coating of photoresist appears to be a promising technique.In this paper,Spray coating and several solution of diluted AZ4620 photoresist are used to form a thick layer on flat wafers and to produce sufficient coverage on wafers with deep cavities ranging from 75 to 425 μm in depth.A number of parameters that strongly influence the spray process are identified and their influence on resist thickness and uniformity is evaluated.The thickness and uniformity achieved is sufficient to pattern contact windows in very deep cavities and rather fine lines across less deep cavities.Several applications for MEMS using the spray coating of photoresist are demonstrated here.These initial results are quite encouraging and well-defined multi-level micromachined structures appear to be feasible.%对于一些MEMS应用,需要在形貌起伏很大的晶圆表面均匀地涂布光刻胶。喷雾式涂胶工艺满足了这些要求。研究了几种稀释的AZ4620光刻胶溶液的雾化喷涂性能,在沈阳芯源微电子设备有限公司KS-M200-1SP喷雾式涂胶机上进行了雾化喷涂试验,分别对裸片及深孔不同尺寸的晶圆进行喷雾式涂胶实验;特别研究了决定喷涂薄膜膜厚和均匀性的光刻胶流量和浓度;实验得到的膜厚和均匀性可以满足图形复杂、有深孔的晶圆。结尾列出了喷雾式涂胶在实际中的一些应用。这些结果证明喷雾式涂胶存在的潜力以及美好前景。