QFN封装元件组装及质量控制工艺

摘要

Q FN 封装由于具有良好的电和热性能、体积小、质量轻，在电子产品中被越来越广泛的推广和应用，针对Q FN 封装元件PC B 焊盘设计、焊膏印刷网板开孔设计、贴装工艺、焊接工艺及返修工艺进行了阐述。%QFN (QuadFlatNo-Lead)Packinghasbeenwidelypromotedandappliedintheelectronic products because of its good electronical and therm al perform ance, sm all volum e and light w eight. In this article, PC B pad design, stencil design for solder paste printing, com ponent m ounting process, reflow soldering and rew ork process ofQ FN packing device w illbe system exposited in detail.