高冲击条件下聚氨酯灌封电路板应力分析

摘要

In order to ensure the internal sealing circuit of weapon system can work more reliable in high shock and vibration environment,the sealing materials often used in weapon system are se-lected as the research object,for example Polyurethane.Printed circuit boards are sealed with different postures (horizontal position,inclined position and vertical position).The strain charac-teristics of printed circuit board in high shock are analyzed using FEA (Finite Element Analysis) software platform LS-DYNA,and the maximum stress element of circuit boards are influenced as change impact value.The results show that,if the position of circuit board is parallel to the di-rection of shock acceleration,the stress of circuit board is less than other positions,and the posi-tion should be advocated in practice.The maximum stress element will change with the impact in-creasing.%为保证武器系统内部灌封电路在高冲击和强振动环境下可以更好工作,以武器系统中常使用的聚氨酯灌封材料为例,对印刷电路板分别水平、倾斜、垂直姿态进行灌封。利用有限元分析软件 LS-DYNA,分析高冲击条件下不同灌封结构中电路板的应力特征,以及随冲击值的增加最大应力单元的变化情况。试验结果表明,电路板摆放方向与冲击加速度方向平行时,应力值小于其他摆放姿态；随着冲击值的增加,最大应力单元会发生偏移。