Bismaleimide (BMI) 5429 resin was analyzed by DSC from room temperature to 350℃ and the dynamic viscosity-temperature characteristics of the BMI resin were studied from room temperature to 180℃. The results show that the DSC curve of the BMI resin has a endothermic peak at 100~150℃,which may come from the dissolution endothermic process of thermoplastic resin or its prepolymer in the BMI resin,and has a curing exothermic peak at 170~300℃. With the increase of temperature,the viscosity of the BMI resin has three stage typical changeable features,which are that the viscosity decreases gradually at first stage and tends to steady after 130℃,then increases rapidly after 170℃. The isothermal viscosity characteristics of the BMI resin were research at 80,85,90,95℃,and a chemorheological model based on the dual-arrhenius viscosity equation of the BMI resin was established. Then the viscosity processing window of the BMI resin at 85~95℃ were predicted by using the model,which provides theoretical basis and basic data for molding application of bismaleimide resin 5429 and its composites.%利用差示扫描量热(DSC)法在室温至350℃范围内对双马来酰亚胺(BMI) 5429树脂进行了分析,并研究了该树脂在室温至180℃范围内的动态黏温特性.结果表明,BMI 5429树脂的DSC曲线在100~150℃附近存在一个吸热峰,其可能来自于树脂中热塑性树脂或其预聚体的溶解吸热;在170~300℃存在一个固化放热峰;随着温度的上升,BMI 5429树脂黏度表现出3个阶段的典型变化特征:第1个阶段黏度逐步降低,130℃后黏度趋于平衡, 170℃后黏度迅速增加.在80,85,90,95℃下对树脂的恒温黏度特性进行了研究,建立了基于双阿累尼乌斯黏度方程的化学流变模型,借助该模型预测了树脂在85~95℃下的低黏度工艺窗口,为BMI 5429树脂及其复合材料成型工艺应用提供了理论依据和基础数据.
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