2-巯基苯并噻唑对化学镀铜的影响

摘要

The effect of 2-mercaptobenzothiazole on deposition rate of electroless copper plating on ABS plastic, as well as the surface morphology, purity, evenness, and crystal type of copper coating was studied using formaldehyde as the reducing agent. The process parameters of electroless copper plating are as follows: CuSO4·5H2O 10 g/L, EDTA-2Na 30 g/L, HCHO 3 mL/L, PEG-1000 2 mg/L, 2-MBT 0-2 mg/L, temperature 70 ℃ or 40 ℃, pH 12.5, and time 1 h. With the addition of low concentration of 2-MBT to the bath, the mixed potential of electroless copper coating becomes more positive, the deposition rate increases, and the density and evenness of Cu coating improves, while the crystal type of coating slightly changes. The obtained Cu coating has high purity as 2-MBT just plays the part of complexant and accelerant during the electroless copper plating.%以甲醛为还原剂,研究了2-巯基苯并噻唑(2-MBT)对ABS塑料化学镀铜沉积速率、铜镀层表面形貌、纯度、平整度及晶型的影响.化学镀铜的工艺条件为:CuSO4·5H2O 10g/L,EDTA-2Na30g/L,HCHO3mL/L,PEG-10002mg/L,2-MBT0～2mg/L,温度70℃或40℃,pH 12.5,时间1 h.镀液中加入低浓度2-MBT后,化学镀铜的混合电位正移,沉积速率提高,铜镀层的致密性和平整性得到改善,但镀层晶型变化不大.2-MBT在化学镀铜中只起配位和加速作用,所得铜镀层纯度较高.