超支化聚苯基硅树脂改性封装用环氧树脂研究

摘要

文中通过合成超支化的聚苯基硅树脂体系，对环氧树脂进行改性，以提升其介电、耐湿、耐热和力学性能。研究表明，超支化聚苯基硅树脂体系（HBPSi）的加入量在0~10wt％时，改性后的树脂体系介电、耐湿、耐热和力学性能随着HBPSi增加而提升；而在大于10wt％时，其性能的提升减缓。产生这种结果主要归因于一方面HBPSi与EP中的羟基反应，消耗了环氧树脂体系的羟基，另一方面是引入了大量的柔性硅氧链节。%In this paper, a novel hyperbranched phenyl silicone resin(HBPSi)was prepared, which was used to modify Epoxy resin(EP). Tests results showed that when the contents of HBPSi were in the range of 0~10wt%, modified EP presents better properties as contents raise more;when the contents were more than 10wt%, properties of Epoxy resin increased slowly. This result is mainly attributed to the reaction of HBPSi and hydroxyl of EP, at the same time, Number of silicon-oxygen chains were grafted to the EP.