四自由度集成芯片装片装置

摘要

介绍了一种自主研发的四自由度集成芯片装片装置的结构及其基于伺服运动卡控制系统。该装置能在X-Y-Z-θ四个自由度上进行检测和定位，实现芯片与引线框架的待贴片位置的实时对准和绑定，从而保证了较高的装片精度和装片效率。应用结果表明：该装置性能可靠、运行稳定，满足高速度、高精度和高性能先进封装规模化生产线要求。%This paper introduces the structure of four degree of freedom integrated chip with a device independent R & D and servo motion control system based on the card.The device can detect and locate in X-Y-Z-.Four degrees of freedom,the chip and the lead frame to patch the real-time location of alignment and binding,so as to ensure the high accuracy and efficiency of loading loading. The application results show that:the device is reliable in performance,stable operation,to meet the high speed, high precision and advanced packaging high performance scale production line.