首页> 中文期刊> 《电子元件与材料》 >无铅焊膏用助焊剂研制

无铅焊膏用助焊剂研制

         

摘要

对助焊剂的活性组分和其他组分采用正交试验进行筛选,根据工业标准对其进行了焊料铺展面积测试,效果较好的活性剂进行复合处理,对配制出的活性剂溶液加入松香配制成助焊剂进行性能测试.结果表明:当有机酸和三乙醇胺的质量比为12:1,占助焊剂质量分数的13.68%时,溶液的pH值达到3.94,扩展率可达80.06%,钎焊后的焊点光亮、无飞溅、残留量低.%The active components and others of the flux were selected by using orthogonal experiment, the solder spread rates were tested according to the industry standard, the better activators were chosen with other components such as the rosin to make the flux, the properties of the flux were tested. The results show when the mass ratio of organic acid and triethanolamine is 12:1 and the mass fraction of activators is 13.68%, the pH value of the flux is 3.94, the spread rate is 80.06%. The flux has good welding performance and the weld spot is bright and fullness, without splash and less residue.

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