叠层片式大电流磁珠的成型工艺

摘要

叠层片式大电流磁珠是一种特殊的叠层片式磁珠,主要应用于电源部分的电磁干扰( EMI)抑制.研究分析了叠层片式大电流磁珠三种主要的成型工艺,及其制作的叠层片式大电流磁珠的优缺点.结果表明,交迭印刷法最适用于叠层片式大电流磁珠的制作；相比较另两种工艺,其优点表现为:合格率最高,达到98.5%；无表面开裂现象,侧面开裂比例最低,仅0.34%；研制的3.2 mm×1.6 mm×0.9 mm(长×宽×厚)、阻抗值220 Ω、额定电流3A的样品,可负载的最大直流电流值相对最大,达到6A.%Multilayer large current chip beads are a special type of multilayer chip beads. This type is mainly used in electro magnetic interference (EMI) of power. Three forming processes of this chip beads, and the shortcoming and virtue of prepared products were investigated. The results indicate that across printing method is the most suitable method for preparation of the multilayer large current chip beads. Compared with other two processes, it has the following advantages: the highest eligible rate, reaching 98.5%; no surface cracking phenomenon, the lowest proportion of side cracking, only being 0.34%; The maximum DC load current value of the sample [dimensions 3.2 mm x 1.6 mm × 0.9 mm (length × width x thickness), impedance 220 ii, rated current 3 A] is the largest compared with that of other processes, reaching 6 A.