多层瓷介电容器失效模式和机理

摘要

Three failure modes of multilayer ceramic capacitor (MLCC), such as open, short, key electrical parameters excursion, are systematically reported. The related failure mechanisms, including void, electrode nubble.delamination, and crack induced by thermal stress and machine stress, are also described. Finally, failure analysis technologies are discussed for MLCC, and some methods to avoid its failure from the viewpoint of design and produce process are suggested.%系统介绍了开路、短路和电参数漂移这三种主要的MLCC失效模式，以及介质层内空洞和电极结瘤、介质层分层、热应力和机械应力引起介质层裂纹、其他微观机理等五种主要的失效机理。针对MLCC的失效分析技术，从生产工艺和使用设计上提出了预防MLCC失效的措施。