用一维金刚石制备氧化铝基复合陶瓷基板

摘要

晶须或纤维是材料补强增韧的有效原料，近年来一直是新材料研究的热点，目前，主要的品种包括碳纤维、SiC 晶须、钛酸铝晶须、氧化铝晶须等。传统的 Al2 O 3或 AlN 低温共烧复合基板，由于玻璃等烧结助剂的加入，陶瓷基板可以实现在900℃以下的温度烧结，但基板导热率也由于玻璃的加入而显著降低。研究表明：高导热的纤维在复合材料中相互搭接形成三维导热网络，可以显著增加复合材料的热导率。金刚石是世界上导热性能最好的材料，本研究探讨了采用一维金刚石作为导热高速网络材料制备金刚石-氧化铝陶瓷基板的可行性。%Whisker or fiber is an efficacious kind of reinforcing material for composite.The research about whisker or fiber has been a hot focus in recent years.Nowadays,the main kinds of one-dimensional material include carbon fiber,SiC whisker,aluminium titanate whisker,alumina whisker, et al.The traditional LTCC substrates of Al2 O 3 or AlN with glass sintering additives could be sintered under 900 ℃,but at the same time the thermal conductivity of substrates reduces radically because of adding the glass additives.Experiment results showed that fiber with high thermal conductivity could lap together to form a three-dimensional heat conduction net which would increase thermal conductivity of composite greatly.Diamond is the best material for heat conduction.The feasibility of fabricating high heat conduction Al2 O 3 composite substrate with one-dimensional diamond network was discussed in this paper.