首页> 中文期刊> 《电路与系统(英文)》 >A Novel High-Performance Lekage-Tolerant, Wide Fan-In Domino Logic Circuit in Deep-Submicron Technology

A Novel High-Performance Lekage-Tolerant, Wide Fan-In Domino Logic Circuit in Deep-Submicron Technology

         

摘要

As technology shrinks in modern era the demand on high speed, low power consumption and small chip area in microprocessors is come into existence. In this paper we have presented a new class of domino circuit design for low power consumption, faster circuit speed and high performance. Due to wide fan-in domino logic, its logic gate suffer from noise sensitivity, if we improve sensitivity, sub-threshold and gate oxide leakage current dominate in evaluation network, which increases the power consumption and reduces the performance of the circuit. The proposed circuit improves the dynamic power consumption and reduces the delay which improves the speed of the circuit. Simulation is performed in BISM4 Cadence environment at 65 nm process technology, with supply voltage 1 V at 100 MHz frequency and bottleneck operating temperature of 27°C with CL = 1 fF. From the result average power improvement by proposed circuit 1 & 2 for 8 input OR gate is 10.1%, 15.28% SFLD, 48.56%, 51.49% CKD, 55.17%, 57.71% HSD and improvement of delay is 1.10%, 12.76% SFLD, 19.13%, 28.63% CKD, 4.32%, 15.59% HSD, 19.138%, 44.25% DFD respectively.

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