采用包括锻造与重熔的应变诱导熔化激活(SIMA)法制备 ZCuSn10铜合金半固态坯料，分析重熔过程中重熔温度和保温时间对ZCuSn10半固态坯料微观组织的影响。结果表明：在900℃保温时，随着保温时间的延长，合金的平均晶粒直径增大，保温时间由5 min延长至50 min时，平均晶粒直径由45.9µm增大至74.7µm；晶粒形状因子随保温时间的延长先减小后增大。保温30 min时，随着保温温度的升高，平均晶粒直径减小，当保温温度由850℃升高至925℃时，平均晶粒直径由72.6µm减小至64.1µm；晶粒形状因子随保温温度的升高而增大。900℃保温30 min获得的半固态组织均匀、球化效果好，平均晶粒尺寸为64.7µm，形状因子为1.65。%Semi-solid ZCuSn10 copper alloy was fabricated by strain induced melt activated (SIMA) method including the forging and remelting process. The effect of remelting temperature and holding time on the microstructure of semi-solid ZCuSn10 copper alloy was investigated. The results indicate that, with the increase of the holding time at 900℃, the mean grain diameter of the alloy increases. With the increase of the holding time from 5 min to 50 min, the mean grain diameter increases from 45.9 µm to 74.7 µm, and the shape factor decreases first and then increases. With the increase of the remelting temperature at the holding time of 30 min, the mean grain diameter decreases. With increasing the remelting temperature from 850℃to 925℃, the mean grain diameter decreases from 72.6 µm to 64.1 µm, and the shape factor increases. The semi-solid ZCuSn10 copper alloy with uniform and spherical grains can be obtained at remelting temperature of 900℃and the holding time of 30 min, the mean grain diameter of the alloy is 64.7 µm and the shape factor is 1.65.
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