Effect of Strain and Strain Rate on Residual Microstructures in Copper

摘要

Several specimens of OFE Cu were deformed in compression to study the resulting microstructures at equivalent levels of threshold stress and strain. Equiaxed, diffuse dislocation cells are more persistent in Cu when tested at strain rates exceeding 10 sup 3 sec sup -1 . At quasi-static strain rates, dislocation collapse into more distinct, narrow microbands occurs at lower strain levels. (ERA citation 11:038244)