基于黏弹性模型的PMMA微流控芯片模内键合微通道变形研究

摘要

针对聚合物微流控芯片模内键合过程中微通道变形的问题,采用黏弹性材料模型对聚甲基丙烯酸甲酯(PMMA)微流控芯片模内键合过程中具有梯形截面的微通道变形进行了仿真分析；研究了在105℃下,芯片微通道在不同键合压力和键合时间下微通道的变形.结果表明:微通道不能保持键合前的尺寸,温升对微通道变形影响很小；微通道顶部与两侧的黏合使得微通道顶部宽度和微通道高度变形远大于底部宽度变形,并随着键合压力的增大而增大；当键合时间超过50 s后,键合时间对微通道变形影响很小,可以采用较长的键合时间来保证键合强度而不影响微通道形貌.%According to the deformation of the microchannel of the polymer microfluidic chip during the bonding in mold process, the viscoelastic material model was used to simulate and analyze the deformation of the trapezoidal cross-section microchannel in the PMMA microfluidic chip bonding in mold process. Researches were done on the deformation of the micro-channel with different bonding pressure and bonding time at 105 t. The results indicated that; The microchannel cannot maintain the size after the bonding. The temperature had little influence on the deformation. MicroChannel adhesion, top and both sides, made ihe top of the microchannel width and microchannel height deformation much larger than the bottom width deformation, and growing with the increase of bonding pressure. If the bonding time was longer than 50 s, bonding time affected the quality little. It was practical to bond for a long time to ensure the bonding strength without affecting the microchannel morphology.