采用APDL语言生成分析文件，建立了LED灯具热沉的有限元模型，以热沉翘片长度、宽度和数目为设计变量，以LED最高结温为目标函数，建立了优化数学模型，采用ANSYS热分析软件进行了优化。结果表明热沉翘片长度越长，芯片最高结温越低；翘片宽度越宽，芯片最高结温越高；随着翘片数目增加，最高结温下降，但到达一定数值时，结温又会缓慢增大。在LED芯片结温不超过60℃的条件下，对热沉结构的优化值分别为：翘片长度为62．5mm，翘片宽度为1mm，翘片数目为20。%Using APDL language to generate the analytic file , it establishes the finite element model for the LED lamp heat sink .Using length , width and numbers of the heat sink fins as the design variables and the LED maximum junction temperature as the objective function , the optimized mathematical model is established and analyzed by ANSYS thermal analysis software .The results show that the longer the length of heat sink fins , the lower the maximum junction temperature of the chip;the wider the fins width , the higher the maximum chip junction temperature;with the increasing of the numbers of fins , the maximum junction temperature will go down;but when reaching a certain value , the junction temperature will slowly increase again.Under the conditions of the LED chip junction temperature not exceeding 60 ℃, the heat sink structure optimized values are:fin length is 62.5mm, fin width is 1mm, the number of fins is 20.
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