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Developing Silicon Pixel Detectors for LHCB: Constructing the VELO Upgrade and Developing a MAPS-Based Tracking Detector

机译:为 LHCB 开发硅像素探测器:构建 VELO 升级并开发基于 MAPS 的跟踪探测器

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摘要

The Large Hadron Collider beauty (LHCb) experiment is currently undergoing a major upgrade of its detector, including the construction of a new silicon pixel detector, the Vertex Locator (VELO) Upgrade. The challenges faced by the LHCb VELO Upgrade are discussed, and the design to overcome them is presented. VELO modules have been produced at the University of Manchester. The VELO modules use 55 micron pixels operating 5.1 mm from the beam without a beam pipe, an innovative silicon microchannel cooling substrate, and 40 MHz readout with a full detector bandwidth of 3 Tb/s. The module assembly process and the results of the associated R&D are presented. The mechanical and electronic tests are described. A grading scheme for each test is described, and the results are presented. The majority of the modules are of excellent quality, with 40 out of 43 of suitable quality for installation in the experiment. A full set of modules for the experiment has now been produced.The VELO Upgrade is read out into a data acquisition system based on an FPGA board. The architecture of the readout firmware for the readout FPGA for the VELO Upgrade is presented, and the function of each block described. Challenges arise due to the design of the VeloPix front end chip, the fully-software trigger and real-time analysis paradigm. These challenges are discussed and their solutions briefly described. An algorithm for identifying isolated clusters is presented and previously-considered approaches discussed. The current design uses around 83% of the available logic blocks, and 85% of the available memory blocks. A complete version of the firmware is now available and is being refined.An ultimate version of the LHCb experiment, the LHCb Upgrade II, is being designed for the 2030s to fully exploit the potential of the high luminosity LHC. The Mighty Tracker is the proposed new combined-technology downstream tracker for Upgrade II, consisting of a silicon pixel inner region and a scintillating fibre outer region. A potential layout of the detector and modules is given. The silicon pixels will likely be the first LHC tracker based on radiation-hard HV-MAPS technology. Studies for the electronic readout system of the silicon inner region are reported. The total bandwidth and its distribution across the tracker are discussed. The numbers of key readout and FPGA DAQ boards are calculated. The detector?¢?€??s expected data rate is 8.13 Tb/s in Upgrade II conditions over a total of more than 46,000 front end chips.
机译:大型强子对撞机 (LHCb) 实验目前正在对其探测器进行重大升级,包括构建新的硅像素探测器,即顶点定位器 (VELO) 升级。讨论了 LHCb VELO 升级面临的挑战,并提出了克服这些挑战的设计。VELO 模块已在曼彻斯特大学生产。VELO 模块使用 55 微米像素,在距离光束 5.1 mm 处工作,无需光束管,采用创新的硅微通道冷却基板,以及 40 MHz 读数,全探测器带宽为 3 Tb/s。介绍了模块组装过程和相关研发的结果。描述了机械和电子测试。描述了每项测试的评分方案,并介绍了结果。大多数模块质量上乘,43 个模块中有 40 个质量适合在实验中安装。现在已经制作了用于实验的全套模块。VELO 升级被读出到基于 FPGA 板卡的数据采集系统中。介绍了用于 VELO 升级的读出 FPGA 的读出固件的架构,并描述了每个模块的功能。由于 VeloPix 前端芯片的设计、全软件触发器和实时分析范式,挑战随之而来。讨论了这些挑战并简要描述了它们的解决方案。提出了一种识别孤立集群的算法,并讨论了以前考虑过的方法。当前设计使用大约 83% 的可用 logic blocks 和 85% 的可用 memory blocks。固件的完整版本现已推出,并且正在完善中。LHCb 实验的终极版本,即 LHCb 升级 II,正在为 2030 年代设计,以充分利用高亮度 LHC 的潜力。Mighty Tracker 是 Upgrade II 提议的新型组合技术下游跟踪器,由硅像素内部区域和闪烁光纤外部区域组成。给出了探测器和模块的潜在布局。硅像素可能是第一个基于抗辐射 HV-MAPS 技术的 LHC 跟踪器。报道了对硅内部区域的电子读出系统的研究。讨论了总带宽及其在跟踪器中的分布。计算密钥读出和 FPGA DAQ 板的数量。探测器?¢?€??在升级 II 条件下,预期数据速率为 8.13 Tb/s,总共超过 46,000 个前端芯片。

著录项

  • 作者

    Murray, Dónal.;

  • 作者单位

    The University of Manchester (United Kingdom).;

    The University of Manchester (United Kingdom).;

    The University of Manchester (United Kingdom).;

  • 授予单位 The University of Manchester (United Kingdom).;The University of Manchester (United Kingdom).;The University of Manchester (United Kingdom).;
  • 学科 Silicon.;Thermal cycling.;Electronics.;Semiconductors.;Communication.;Radiation.;Sensors.;Physics.
  • 学位
  • 年度 2022
  • 页码 225
  • 总页数 225
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Silicon.; Thermal cycling.; Electronics.; Semiconductors.; Communication.; Radiation.; Sensors.; Physics.;

    机译:硅。;热循环。;电子。;半导体。;通讯。;辐射。;传感器。;物理。;

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