Nano Cu an alternative to high temperature solder is developed by the Advance Technological Center at the Lockheed Martin Corporation. A printable paste of Cu nano particles is developed with an ability to fuse at 200°C in reflow oven. After reflow the deposited material has nano crystalline and nano porous structure which affects its properties.;Accelerated test are performed on nano Cu deposition having nano porous and nano crystalline structure for assessment and prediction of reliability. Nano Cu assemblies with different bond layer thickness are sheared to calculate the strength of the material and are correlated with the porous and crystalline structure of nano Cu. Thermal and isothermal fatigue test are performed on nano Cu to see the dependency of life on stress and further surface of failed assemblies were observed to determine the type of failure. Creep test at RT are performed to find the type of creep mechanism and how they are affected when subjected to high temperature. TEM, SEM, X-ray, C-SAM and optical microscopy is done on the nano Cu sample for structure and surface analysis.
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