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Grain boundary structure in twist-type Si bicrystals made from SOI and dopant activation in SOI by high density of currents.

机译:SOI形成的扭曲型Si双晶中的晶界结构和高电流密度在SOI中激活掺杂剂。

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摘要

A new approach for preparing twist-type Si bicrystals and compliant substrates is reported. Thin Si single crystal films prepared from Silicon-On-Insulator (SOI) can be bonded to each other or to Si substrates. Thousands of Si bicrystals bonded at different twist angles can be obtained in a single preparation process and are ready for transmission electron microscopy (TEM) examination. Plan-view and high resolution cross-sectional TEM images of the Si bicrystalsare presented. Images of screw dislocation networks and Moiré fringes of low-angle twist-type Si boundaries are obtained. This technique facilitates the systematic study of low- and high-angle grain boundary structures of Si. One application of the technique is fabrication of compliant substrates for heteroepitaxial growth of SiGe. 6000 Å Si70Ge30 film was grown by MBE. Cross-sectional TEM images of the film are shown.; Heavily ion-implanted boron-doped and arsenic-doped SOI strips were shown to be activated by applying an electrical current. For these samples, patterned SOI stripes were implanted by 40 KeV BF2+ or As + at a dosage of 5 × 1015 ions/cm2. Without post-implantation annealing, these implanted SOI strips could be activated by applying a current up to 1 × 106 A/cm2; for example, the resistance decreased from 8.80 to 0.61 KΩ for a 10 μm wide, 50 μm long, and 0.2 μm thick n+ silicon strip. This reduction of resistance was close to that obtained by the conventional post-implantation annealing at 900°C for 30 minutes. To separate the effect of Joule heating from current density activation, the temperature of the SOI strips during the cycle of current stressing was measured by Pt sensors. The result indicates that the temperature rise due to Joule heating was low and could not explain the observed activation. We conclude that implanted dopants in Si could be activated by current stressing. To confirm the electrical activation, the carrier concentration was obtained by Hall measurement.
机译:报道了一种制备扭曲型硅双晶和柔性衬底的新方法。由绝缘体上硅(SOI)制成的Si单晶薄膜可以相互粘合或与Si衬底粘合。可以在一个制备过程中获得成千上万个以不同扭转角键合的Si双晶硅,并准备进行透射电子显微镜(TEM)检查。给出了硅双晶的平面图和高分辨率横截面TEM图像。获得了低位扭曲型硅边界的螺旋位错网络和莫尔条纹的图像。该技术有助于系统地研究硅的低角度和高角度晶界结构。该技术的一种应用是制造用于异质外延生长SiGe的顺应性基板。 MBE生长了6000ÅSi 70 Ge 30 薄膜。示出了膜的横截面TEM图像。大量离子注入的硼掺杂和砷掺杂的SOI条带显示通过施加电流而被激活。对于这些样品,图案化的SOI条带以5×10 15的剂量注入40 KeV BF 2 + 或As + 离子/ cm 2 。如果不进行注入后退火,则可以通过施加高达1×10 6 A / cm 2 的电流来激活这些注入的SOI条;例如,对于10μm宽,50μm长和0.2μm厚的n + 硅带,电阻从8.80KΩ降低到0.61KΩ。电阻的降低接近于在900℃下进行传统的植入后退火30分钟所获得的降低。为了将焦耳加热的影响与电流密度激活分开,通过Pt传感器测量了电流应力循环过程中SOI条的温度。结果表明,由于焦耳加热引起的温度升高很小,不能解释所观察到的活化。我们得出的结论是,电流应力可以激活Si中注入的掺杂剂。为了确认电激活,通过霍尔测量获得载流子浓度。

著录项

  • 作者

    Chen, Chih.;

  • 作者单位

    University of California, Los Angeles.;

  • 授予单位 University of California, Los Angeles.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1999
  • 页码 113 p.
  • 总页数 113
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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