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A thick polysilicon surface micromachined accelerometer based on optical intensity modulation.

机译:基于光强度调制的厚多晶硅表面微机械加速度计。

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Studies of MEMS devices in recent years have shown that the performance of the devices is dependent on the basic material quality. Current research and development in surface micromachining are focusing on ways of improving the stability of mechanical properties and increasing the thickness of the polysilicon film. In this work, we have developed a new thick polysilicon surface micromachining technology. A 12μm thick polysilicon film is processed and has a small tensile residual stress of approximately 0.6MPa with no visible stress gradient. Surface roughness is estimated in the range of 3% of the film thickness with a root mean square (rms) value of approximate 30 nm over a 100μm2 area. The consistency of the measurements for the different batches of wafers demonstrates the ultimate success of the thick polysilicon process. This new technology offers more flexibility in the design of MEMS devices. The important design parameters can therefore be independently varied depending on the necessary resolution and sensitivity requirements. In addition, this new technology is compatible with VLSI fabrication, allowing integration with on-chip electronics and use of standard fabrication tools.; Current accelerometers in MEMS market are susceptible to electromagnetic interference or thermal fluctuations. As a result, an accelerometer that is economically feasible and workable in the most severe as well, as typical environments is needed. A miniature thick polysilicon accelerometer, whose motion is detected by optical intensity modulation due to the interaction between a light beam and a moving optical grating has been designed, fabricated and tested.; Testing results are obtained using a vibration table to simulate acceleration for a device that was designed with a sensitivity of mg, an intermediate value among the conventional accelerometers currently available. A linear characteristic between acceleration and output signal is obtained in the acceleration range of 0 to 8g, which is limited by the instrumentation. Sensitivity of 180mV/g is measured and noise analysis shows a 5mV/rt Hz response. As a result, the resolution is in the mg/rt Hz range, as expected.; The accelerometer has the advantages of simplicity, high reliability, low cross talk and low cost. An inexpensive light-emitting diode (LED), white light source, or even an off the shelf light bulb can be used to provide illumination.
机译:近年来对MEMS器件的研究表明,器件的性能取决于基本的材料质量。表面微加工的当前研究和开发集中在改善机械性能的稳定性和增加多晶硅膜的厚度的方法上。在这项工作中,我们开发了一种新的厚多晶硅表面微加工技术。加工了一个12μm厚的多晶硅膜,该膜的拉伸残余应力小,约为0.6MPa,没有可见的应力梯度。估计表面粗糙度在膜厚度的3%范围内,在100μm 2 区域内的均方根(rms)值约为30 nm。对于不同批次的晶片,测量结果的一致性证明了厚多晶硅工艺的最终成功。这项新技术为MEMS器件的设计提供了更大的灵活性。因此,重要的设计参数可以根据必要的分辨率和灵敏度要求进行独立更改。此外,这项新技术与VLSI制造兼容,从而允许与片上电子设备集成并使用标准制造工具。 MEMS市场中的当前加速度计容易受到电磁干扰或热波动的影响。结果,需要一种加速度计,该加速度计在经济上可行并且在典型环境下也可以在最恶劣的环境下使用。设计,制造和测试了一种微型厚多晶硅加速度计,该加速度计的运动是由于光束和移动光栅之间的相互作用而通过光强度调制来检测的。测试结果是使用振动表获得的,该振动表可模拟设计为灵敏度为mg的设备的加速度,该灵敏度为当前可用的传统加速度计的中间值。加速度和输出信号之间的线性特性是在0到8g的加速度范围内获得的,这受仪器的限制。测量的灵敏度为180mV / g,噪声分析显示响应为5mV / rt Hz。结果,分辨率在预期的mg / rt Hz范围内。该加速度计具有简单,高可靠性,低串扰和低成本的优点。可以使用便宜的发光二极管(LED),白光源,甚至是现成的灯泡来提供照明。

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