Identification and control of grinding processes for intermetallic compounds.

摘要

An intermetallic compound (IMC) is a combination of two or more metals with a particular atomic formula by having either ionic and covalent bonds, or metallic bonds with specific crystal structures. They may be thought of as the intermediate between metals and ceramics. These new materials may combine the best of each class: the ductility, heat and electric conductivity of metals with the strength and oxidation resistance of ceramics.; Previous study has proposed that the depth of plastic deformation can be used as a parameter to describe the influence of grinding conditions on other physical properties of subsurface layers. Accordingly, the indentation model has been developed to correlate the depth of plastic deformation with the normal component of grinding force. It has been reported that the under certain grinding conditions the depth of plastic deformation does not follow the indentation model. The primary objective of this research is to explain such deviations and to demonstrate that this model can be used to control and predict the depth of plastic deformation.; Elements of this research include the development of an open architecture platform to study grinding process, a signal processing algorithm for gap elimination, introducing and implementation of model reference unfalsification and learning concept, development of a mathematical model for grinding γ-TiAl, a comparison between conventional and superabrasive grinding, control and prediction of the depth of plastic deformation, and initiation of one of the first databases for grinding γ-TiAl.; This work not only serves as a step toward the use of IMCs in future technology but also serves as a step toward autonomous machining systems using intelligent control and advanced monitoring which is a feature of the future abrasive technology.