Investigation of tractable models of coupling between MMICs in multi-chip assemblies.

摘要

This work investigates tractable models of coupling between monolithic microwave integrated circuits (MMICs) in multi-chip assemblies (MCAs). In this dissertation, CAD algorithms are developed for computing the coupling between MMICs in a various types of MCAs such as multi-layer MCA, MCA with MMICs covered by dielectric covers, MCA with MMICs separated by baffles, and MCA with posts separating or around MMICs. These CAD algorithms are computationally simple, appropriate for use with layout-based circuit CAD software, and use no numerical electromagnetics. They have been tested by comparison to full wave electromagnetic simulations and measurements on frequency scaled down test structures. In simple test cases, these algorithms showed over two orders of magnitude increase in speed. For larger problems, the increase in speed will be more pronounced.