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Surface chemistry and electronic properties of nitride semiconductors studied via synchrotron-based photoemission spectroscopy.

机译:通过基于同步加速器的光发射光谱研究了氮化物半导体的表面化学和电子性质。

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The effects of both KOH and HCl treatments on the surface chemistry and electronic properties of n-GaN were studied via synchrotron radiation-based photoemission spectroscopy. The HCl treatment increases the Ga/N atomic ratio at the surface, while KOH treatment decreases this ratio of surface atoms. The HCl treatment can be used to lower the surface barrier on n-GaN prior to metal deposition to aid in ohmic contact formation.; The Schottky barrier heights for Au, Al, Ni, Pd, Pt, and Ti on both n-GaN and p-GaN were measured via photoemission spectroscopy. For this set of six metals, two Fermi level pinning behaviors were observed. For Au, Ti, and Pt, the Fermi level position occurs at an energy 0.5 eV higher within the band gap of n-GaN than the Fermi level position for the same metal deposited on p-GaN. In contrast, for Al, Ni and Pd, the Fermi level lies at a single energy within the band gap when deposited on either n-GaN or p-GaN. None of the six metals is observed to grow layer-by-layer on the GaN surface; instead growth is consistent with either the Volmer-Weber or Stranski-Krastanov modes. In the case of Au, islanding is clearly observed through atomic force microscopy images.; Cleaning treatments, and metal deposition and the electron accumulation phenomenon were investigated on both InAs and InN via photoemission spectroscopy. Due to insufficient removal of oxides on the InAs surface, the valence band maximum could not be observed in the photoelectron spectrum and therefore the correct Fermi level position in the band gap of InAs could not be determined. This prevents any conclusions from being drawn about the presence of an electron accumulation on this InAs. Both annealing and sputter-cleaning of InN allowed the valence band maximum to be determined. The deposition of Au on annealed-InN yielded a Fermi level energy, 0.7 ± 0.1 eV above the valence band maximum. Ti deposited on a sputtered-InN sample had a Fermi level energy 1.6 ± 0.1 eV above the valence band maximum. The current controversy surrounding the band gap of InN affects the conclusions which can be drawn concerning the presence of an electron accumulation layer. If the smaller band gap of 0.7 eV is assumed, then an electron accumulation would exist on the samples with both Au and Ti overlayers. Au was observed to grow as islands on the InAs surface as observed through both photoemission and atomic force microscopy. Au also appeared to grow through the formation of islands on annealed-InN when observed through photoemission spectroscopy.
机译:通过基于同步辐射的光发射光谱研究了KOH和HCl处理对n-GaN表面化学和电子性能的影响。 HCl处理增加了表面的Ga / N原子比,而KOH处理则减少了表面原子的比。 HCl处理可用于在金属沉积之前降低n-GaN的表面势垒,以帮助形成欧姆接触。通过光发射光谱法测量了n-GaN和p-GaN上Au,Al,Ni,Pd,Pt和Ti的肖特基势垒高度。对于这六种金属,观察到两种费米能级钉扎行为。对于Au,Ti和Pt,费米能级位置在n-GaN的带隙内的能量比在p-GaN上沉积的相同金属的费米能级位置高0.5 eV。相反,对于Al,Ni和Pd,当沉积在n-GaN或p-GaN上时,费米能级位于带隙内的单个能量处。观察到六种金属中没有一种在GaN表面上逐层生长。相反,增长与Volmer-Weber或Stranski-Krastanov模式一致。在金的情况下,通过原子力显微镜图像可以清楚地观察到孤岛。通过光发射光谱法研究了InAs和InN上的清洗处理,金属沉积和电子积累现象。由于没有充分去除InAs表面上的氧化物,因此在光电子光谱中无法观察到价带最大值,因此无法确定InAs带隙中正确的费米能级位置。这可以防止得出关于在该InAs上存在电子累积的任何结论。 InN的退火和溅射清洗都可以确定价带最大值。在退火的InN上沉积Au产生费米能级,比价带最大值高0.7±0.1 eV。沉积在溅射InN样品上的Ti的费米能级能量比价带最大值高1.6±0.1 eV。围绕InN带隙的当前争议影响了可以得出的有关电子积累层存在的结论。如果假设带隙较小,为0.7 eV,则在具有Au和Ti覆盖层的样品上将存在电子积累。通过光发射和原子力显微镜观察,观察到金在InAs表面上生长为岛。通过光发射光谱观察时,金也似乎通过在退火的InN上形成岛而生长。

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