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Silicon processed microstructures using self-aligned plastic deformation.

机译:硅加工的微结构利用自对准塑性变形。

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摘要

Two self-aligned plastic deformation processes are developed to fabricate silicon microstructures, including angular vertical comb-drives, scanning micromirrors, variable capacitors, and two-axial actuators based on global-furnace and localized-Joule heating methods. As a proof-of-concept demonstration, an ultrasonic packaging procedure that generates local plastic deformation of metallic bonding materials is also established for MEMS packaging applications.; Plastic deformation of silicon occurs at elevated temperature when silicon is stressed to a level higher than the reduced yield stress. The self-aligned plastic deformation process developed in this work utilizes the "keys and key-slots" design between a lid and device substrate for self-alignment and micropillars are constructed on the lid substrate to provide mechanical stress on silicon microstructures. Vertically driven electrostatic microactuators are designed and fabricated by the aforementioned processes, eliminating the difficulties in alignment, wafer bonding and multi-masks processes.; First angular vertical comb-drives with self-aligned comb fingers are fabricated by the global plastic deformation process where the whole silicon substrate is annealed at high temperature. The fabricated scanning mirror actuators resonate at frequencies between 1.90 and 5.33 kHz, achieving optical scanning angles up to 19.2 degrees with driving voltages of 40Vdc plus 13Vpp and a quality factor of 120. A small amount of elastic recovery is observed after the plastic deformation process and is experimentally characterized to give a design guideline. After continuous testing of 5 billion cycles at the maximum scanning angle on one fabricated scanning mirror, no clear degradation or sign of fatigue was observed.; Second the localized plastic deformation process is applied to fabricate torsional scanning micromirrors with special torsional spring designs to eliminate the buckling effect due to thermal expansion of plastically deformable fixed-fixed beams during the localized heating and plastic deformation process. Improved actuator design with double-sided symmetric angular vertical comb-drives achieved 50.9 degrees of optical scanning angle at a resonant frequency of 4.13 kHz with a quality factor of 202 under driving voltages of 30Vdc plus 14Vpp. The extended reliability tests of 20 billion cycles reveal no observable degradations.; Applications of microstructures fabricated by the self-aligned plastic deformation processes are further illustrated in variable capacitors, two-axial actuators and vertically driven linear actuators. Design and process variations of the self-aligned plastic deformation could lead to new device architectures for microsystems.
机译:开发了两种自对准塑性变形工艺来制造硅微结构,包括基于整体炉和局部焦耳加热方法的角形垂直梳状驱动器,扫描微镜,可变电容器和两轴驱动器。作为概念证明,还建立了一种超声波封装程序,该程序会产生金属结合材料的局部塑性变形,以用于MEMS封装应用。当硅承受的应力高于降低的屈服应力时,硅的塑性变形会在高温下发生。在这项工作中开发的自对准塑性变形过程利用了盖子和设备基板之间的“键和键槽”设计来实现自动对准,并且在盖子基板上构造了微柱,以在硅微结构上提供机械应力。垂直驱动的静电微致动器是通过上述工艺设计和制造的,消除了对准,晶片键合和多掩模工艺的困难。通过整体塑性变形工艺制造了具有自对准梳齿的第一角垂直梳齿驱动器,其中整个硅衬底在高温下退火。所制造的扫描镜致动器在1.90至5.33 kHz的频率下谐振,在40Vdc加13Vpp的驱动电压和120的品质因数下实现高达19.2度的光学扫描角。在塑性变形过程和通过实验表征以提供设计指南。在一个装配好的扫描镜上以最大扫描角度连续测试了50亿次循环之后,没有观察到明显的退化或疲劳迹象。其次,将局部塑性变形过程应用于具有特殊扭转弹簧设计的扭转扫描微镜,以消除由于在局部加热和塑性变形过程中可塑性变形的固定梁的热膨胀而引起的屈曲效应。在30Vdc加14Vpp的驱动电压下,采用双面对称角垂直梳状驱动器的改进型执行器设计在共振频率为4.13 kHz时实现了50.9度的光学扫描角,其品质因数为202。扩展的200亿个周期的可靠性测试表明没有可观察到的退化。通过自对准塑性变形过程制造的微结构的应用在可变电容器,两轴致动器和垂直驱动的线性致动器中得到进一步说明。自对准塑性变形的设计和工艺变化可能会导致新的微系统设备架构。

著录项

  • 作者

    Kim, Jongbaeg.;

  • 作者单位

    University of California, Berkeley.;

  • 授予单位 University of California, Berkeley.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 138 p.
  • 总页数 138
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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