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首页> 外文期刊>Metallurgia Italiana >STUDY OF THE MICROSTRUCTURE OF A COMMERCIALLY PURE ALUMINIUM SUBJECTED TO SEVERE PLASTIC DEFORMATION. PART I: MICROSTRUCTURE
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STUDY OF THE MICROSTRUCTURE OF A COMMERCIALLY PURE ALUMINIUM SUBJECTED TO SEVERE PLASTIC DEFORMATION. PART I: MICROSTRUCTURE

机译:商业纯铝严重塑性变形的微观组织研究。第一部分:微观结构

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摘要

Microstructure evolution with increasing severe deformation, via equal channel angular pressing (ECAP), was investigated in a commercially pure 1200 aluminium. A true strain of 8 was sufficient at producing sub-micrometer scale grains and very fine subgrains in the grain interior. The deformation process was documented and described through field-emission gun scanning and transmission electron microscopy techniques. The largest fraction of high-angle grain boundaries, after 8 ECAP passes, accounted for ~72 percent of all boundaries. The fine spacing resolution achieved by field-emission gun scanning electron microscopy allowed detailed statistical grain and subgrain evaluation of the deformed microstructure, while transmission electron inspections let to. appreciate and point out the very low-angle misorientation boundaries role within the microstructure refining -process. ECAP results were compared to the mechanisms involved in cold rolling. The use of FEG-SEM was of paramount interest essentially for the potentialities coming from the orientation image maps (OIM), which allows to directly detect the overall grained and subgrained structure. This type of analysis would require a time consuming procedures by using conventional TEM techniques. Thus, FEG-SEM constitutes a unique methodology for the volume evaluation of the perimeter of either subgrains and grains decorating the microstructure. As a counterpart, TEM seems to maintain the unique attitude for studies on the early stages of deformed microstructure such as the detection of cell and micro-bands boundaries whose typical disorientation lies in the range of 0.1-0.2 deg .
机译:在商业上纯的1200铝中,通过等通道角挤压(ECAP)研究了随着严重变形而增加的微观组织演变。 8的真实应变足以在晶粒内部产生亚微米级的晶粒和非常细的亚晶粒。通过场发射枪扫描和透射电子显微镜技术记录并描述了变形过程。经过8个ECAP之后,高角度晶界的最大部分占所有晶界的约72%。通过场发射枪扫描电子显微镜获得的精细间距分辨率可以对变形的微观结构进行详细的晶粒和亚晶粒统计评估,而透射电子检查则允许。赞赏并指出微结构精炼过程中极低角度的取向障碍边界作用。将ECAP结果与冷轧所涉及的机制进行了比较。 FEG-SEM的使用最重要的是对于来自定向图像图(OIM)的电势,它可以直接检测总体的颗粒和亚颗粒结构。通过使用常规TEM技术,这种类型的分析将需要耗时的过程。因此,FEG-SEM构成了一种独特的方法,用于评估装饰微结构的亚晶粒和晶粒的周长。作为对应,TEM似乎保持了对变形微观结构的早期研究的独特态度,例如检测细胞和微带边界,其典型的取向在0.1-0.2度之间。

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