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Modifications of electronic and chemical properties of gallium antimonide surface for device applications.

机译:用于设备的锑化镓表面电子和化学性质的改性。

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Gallium antimonide (GaSb) is an important III-V compound semiconductor for optoelectronic devices operating in the infrared and near-infrared region. However the as-received GaSb surface is characterized by a thick layer of native oxide and a high density of mid-gap surface states, which reduces the minority carrier life-time and the device efficiency. Reduction in the surface defect concentration by control over the electronic and chemical properties of the GaSb surface is important in improving GaSb-based devices. In this work, the chemical processes for surface oxide reduction and electronic passivation of the GaSb (001) surface were developed and optimized. The surface chemical and electronic properties were investigated by X-ray photoelectron spectroscopy and photoluminescence.; In obtaining a smooth and clean GaSb substrate, non-aqueous processing is necessary, and the etching reagent with a low reaction rate with GaSb surface is desirable. Preparation of the GaSb surface by dipping into concentrated HCl followed by a 2-propanol rinse results in an atomic flat surface with a thin oxide overlayer. Elemental antimony, generated during the thermal oxidation of GaSb, is mainly responsible for the high density of mid-gap surface states. To electronically passivate the GaSb surface, a non-aqueous Na2S passivation regime was developed using inert solvent-benzene. This regime requires the addition of a chelating agent (15-crown-5) to solubilize Na 2S, and an organic oxidizing agent (anthraquinone, etc.) to act as an electron acceptor. The non-aqueous passivation process results in higher sulfide coverage, and lower content of the residual oxide and elemental Sb than that produced by aqueous-based passivation. Adsorption of group VI elements on the GaSb surface can effectively reduce the gap-region surface state density. Non-aqueous chalcogenide treatments using Na2S, Na2Se and Na2Te in benzene-based solutions result in a consistent enhancement in the photoluminescence yield. Sulfidization provides a higher concentration of Ga(Sb)-chalcogen bonds than does the use of Na2Se or Na2Te. The adsorption of selenium on the GaSb surface proceeds initially rapidly, followed by a much reduced adsorption rate as the selenide coverage increases. The adsorption process was analyzed based on a single precursor-mediated chemisorption, and the kinetics were derived using Langmuir-based adsorption and the coverage-dependent adsorption models.
机译:锑化镓(GaSb)是重要的III-V化合物半导体,适用于在红外和近红外区域工作的光电器件。然而,原样的GaSb表面的特征在于厚的天然氧化物层和中间隙表面态的高密度,这减少了少数载流子的寿命和器件效率。通过控制GaSb表面的电子和化学性质来减少表面缺陷浓度对于改进基于GaSb的器件非常重要。在这项工作中,GaSb(001)表面的表面氧化物还原和电子钝化的化学过程得到了开发和优化。通过X射线光电子能谱和光致发光研究了表面化学和电子性质。为了获得光滑且清洁的GaSb衬底,需要非水处理,并且期望与GaSb表面具有低反应速率的蚀刻剂。通过浸入浓盐酸中,然后用2-丙醇冲洗来制备GaSb表面,会得到原子表面平坦的氧化物薄层。 GaSb热氧化过程中产生的元素锑,主要是造成中间能隙表面态密度高的原因。为了电子钝化GaSb表面,使用惰性溶剂苯开发了非水Na2S钝化方案。该方案需要添加螯合剂(15-crown-5)以溶解Na 2S,并添加有机氧化剂(蒽醌等)作为电子受体。与水基钝化相比,非水钝化工艺可导致更高的硫化物覆盖率以及更低的残留氧化物和元素Sb含量。 GaSb表面吸附VI族元素可有效降低间隙区表面态密度。在苯基溶液中使用Na2S,Na2Se和Na2Te的非水硫属化物处理可导致光致发光产量的稳定提高。与使用Na2Se或Na2Te相比,硫化提供了更高浓度的Ga(Sb)-硫族元素键。硒在GaSb表面的吸附开始时迅速进行,随后随着硒化物覆盖率的增加,吸附速率大大降低。基于单个前体介导的化学吸附来分析吸附过程,并使用基于Langmuir的吸附和依赖于覆盖率的吸附模型得出动力学。

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