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Integration of ferroelectric thin films in microwave devices .

机译:微波器件中铁电薄膜的集成。

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摘要

Recent growth in wireless communication industry has led to a growing search for alternative technologies that can provide higher flexibility and efficiency in the handling of radio frequency spectrum, and preferably at a similar or lower cost than the present technologies. Thin film barium strontium titanate has shown great promises for microwave applications. There are two goals in this thesis: (1) To show a methodology for integration of BST thin films in microwave devices operating at frequencies above 6 GHz, and (2) To explore the limits of material optimization for increased device performance.;The integration of BST thin film with a 3rd order combline-based bandpass filter in the frequency range of 6 to 18 GHz was demonstrated. Alumina substrates with filled vias were used to support the devices. Optimized (Ba 0.7Sr0.3)TiO3 film was deposited and patterned in alumina substrate. Planar gap capacitors were patterned with a Cr/Au metal stack while the rest of the device layout was patterned with silver metal and electroplated with copper. The measured microwave characteristics of the bandpass filters fall within the specifications of the design but more improvements were needed to lower the insertion loss and the frequency tunability for devices operating at frequency above 12 GHz.;The metallization impact on the microwave devices was studied. Two variables were tested with electroplated copper: (1) Thickness, and (2) geometry with respect to the gap. Increasing the thickness of the copper decreases the insertion loss of the device. Metal thickness beyond three skin depths does not impart significant improvement. Plating distances to the edge of the gap in the capacitor has not effect in the insertion loss of the filter.;Tunability limit of coplanar gap capacitors was investigated. A series of gap capacitors with different geometry were tested. In the limit of low capacitance values, a fringe capacitance is observed, which measured to be in the range of 50-100 fF. The non-tunable capacitance contributes to the low tunability of the 12-18 GHz range bandpass filter, where the required capacitance values for impedance matching, 200-400 fF, are close to the values of the fringe. A coplanar MIM capacitor structure is proposed to improve the tunability values. The configuration consists of a sapphire substrate, followed by the metal coplanar electrodes (Pt/Ti stack deposited by e-beam evaporation) and then capped with the BST layer. Tunability values of 50% were obtained with an electric field of 125 KV/cm for an interdigitated coplanar MIM capacitor.
机译:无线通信行业的最新发展导致对替代技术的搜索日益增加,这些替代技术可以在处理射频频谱时提供更高的灵活性和效率,并且优选地以与当前技术相似或更低的成本提供服务。薄膜钛酸锶锶已显示出对微波应用的巨大希望。本论文有两个目标:(1)展示一种将BST薄膜集成在工作于6 GHz以上频率的微波设备中的方法,以及(2)探索材料优化以提高设备性能的局限性。说明了在6至18GHz的频率范围内具有基于三阶基于梳状线的带通滤波器的BST薄膜的制造方法。具有填充通孔的氧化铝衬底用于支撑器件。在氧化铝基板上沉积优化的(Ba 0.7Sr0.3)TiO3薄膜并对其进行构图。平面间隙电容器用Cr / Au金属叠层构图,而其余器件布局则用银金属构图并电镀铜。带通滤波器的实测微波特性在设计规范范围内,但仍需要进一步改进以降低工作在12 GHz以上频率的设备的插入损耗和频率可调性。研究了金属化对微波设备的影响。使用电镀铜测试了两个变量:(1)厚度,(2)相对于间隙的几何形状。铜厚度的增加会降低器件的插入损耗。金属厚度超过三个趋肤深度并不能带来明显的改善。电容器间隙距离边缘的电镀距离不会影响滤波器的插入损耗。;研究了共面间隙电容器的可调谐性极限。测试了一系列具有不同几何形状的间隙电容器。在低电容值的极限中,观察到边缘电容,其测量值在50至100 fF的范围内。不可调节的电容会导致12-18 GHz范围带通滤波器的低可调性,其中阻抗匹配所需的电容值200-400 fF接近条纹的值。提出了共面MIM电容器结构以提高可调谐性值。该配置包括一个蓝宝石衬底,然后是金属共面电极(通过电子束蒸发沉积的Pt / Ti叠层),然后用BST层覆盖。对于叉指共面MIM电容器,在125 KV / cm的电场下可获得50%的可调值。

著录项

  • 作者

    Lam, Peter Gaifun.;

  • 作者单位

    North Carolina State University.;

  • 授予单位 North Carolina State University.;
  • 学科 Engineering Electronics and Electrical.;Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 185 p.
  • 总页数 185
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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