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Self-sacrificial surface-micromachining using poly(methyl methacrylate) .

机译:使用聚(甲基丙烯酸甲酯)的自牺牲表面微加工。

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摘要

This thesis describes work performed on a novel form of surface-micromachining, called self-sacrificial surface-micromachining, and an example surface-micromachining process that uses poly(methyl methacrylate) (PMMA) as both the structural and the sacrificial materials. PMMA is a common material in microfabrication processes, as it is an important resist material for many types of radiation. The same properties that make it useful as a resist also make PMMA particularly suited for the unusual form of surface-micromachining described herein.;The main contribution of this thesis is the introduction of self-sacrificial surface-micromachining. In contrast to traditional surface-micromachining, self-sacrificial processes do not deposit separate structural and sacrificial materials. Instead, a self-sacrificial process deposits a single material, and relies on an in situ chemical modification to convert it from a structural material to a sacrificial material, or vice versa. Pattern transfer through in situ chemical change, rather than etching, is the characteristic that separates traditional surface-micromachining from its self-sacrificial variant. Self-sacrificial processes show a number of interesting properties compared to traditional surface-micromachining.;The resulting process is capable of fabricating standard surface-micromachining components, although details obviously require changes due to different mechanical and electrical properties. Because of the particular material system used to illustrate self-sacrificial processing, the entire process can be carried out at low temperatures. The process described in this work is, therefore, also notable as a potential approach to integrating surface-micromachining and CMOS.;This thesis discusses the concept of self-sacrificial surface-micromachining, as well as discusses the details necessary to implement a self-sacrificial process using a particular material, PMMA.;Considerable work on characterizing the exposure and development of PMMA was undertaken to complete this thesis. In general, PMMA is a very well characterized material. Its relatively simple chemistry and huge importance as a resist has led to an extensive literature. However, the radiation source used in this thesis is fairly unusual, deep-UV at 254 nm. Consequently, the literature on PMMA irradiated at this wavelength is very thin, necessitating further research to support the development of the surface-micromachining process.;Keywords. poly (methyl methacrylate): surface-micromachining: self-sacrificial: deep-UV: lithography.
机译:本论文描述了在一种新型表面微加工(称为自牺牲表面微加工)上进行的工作,以及使用聚甲基丙烯酸甲酯(PMMA)作为结构材料和牺牲材料的示例性表面微加工工艺。 PMMA是微细加工过程中的常用材料,因为它是许多类型辐射的重要抗蚀剂材料。使它可用作抗蚀剂的相同性能也使PMMA特别适用于本文所述的表面微加工的异常形式。本论文的主要贡献是引入了自我牺牲表面微加工。与传统的表面微机械加工相反,自我牺牲工艺不会沉积单独的结构材料和牺牲材料。取而代之的是,一种自我牺牲过程会沉积一种材料,并依靠原位化学修饰将其从结构材料转换为牺牲材料,反之亦然。通过原位化学变化而不是蚀刻进行图案转移是将传统的表面微加工与其自我牺牲型产品区分开的特征。与传统的表面微机械加工相比,自我牺牲工艺显示出许多有趣的特性。最终的工艺能够制造标准的表面微机械加工组件,尽管由于机械和电气特性的不同,细节显然需要改变。由于用于说明自我牺牲过程的特定材料系统,整个过程可以在低温下进行。因此,这项工作中描述的工艺也是将表面微加工和CMOS集成在一起的一种潜在方法。本论文讨论了自我牺牲表面微加工的概念,并讨论了实现自我微加工的必要细节。使用一种特定的材料PMMA进行了牺牲过程。在完成PMMA的曝光和显影特性方面进行了大量的工作。通常,PMMA是一种很好表征的材料。其相对简单的化学性质和作为抗蚀剂的巨大重要性导致了广泛的文献报道。但是,本文中使用的辐射源是非常不寻常的,在254 nm处具有深紫外线。因此,关于在该波长下辐照的PMMA的文献非常薄,因此有必要进行进一步的研究以支持表面微加工工艺的发展。聚(甲基丙烯酸甲酯):表面微加工:自我牺牲:深紫外线:光刻。

著录项

  • 作者

    Johnstone, Robert W.;

  • 作者单位

    Simon Fraser University (Canada).;

  • 授予单位 Simon Fraser University (Canada).;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 193 p.
  • 总页数 193
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 能源与动力工程;
  • 关键词

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