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Surface Amorphization in Zr Alloy Films via Ni Implantation

机译:镍注入锆合金薄膜的表面非晶化。

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Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As-deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ~100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at%Ni for Zr, 6at%Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.
机译:已经对溅射沉积的Zr和Zr-Cu膜进行了Ni注入,以通过透射电子显微镜(TEM)和X射线光电子能谱(XPS)研究与Ni成比例的表面非晶化行为。在具有一定面积目标材料的(001)Si衬底上制备了厚度为200nm的Zr和Zr-Cu膜。沉积膜显示柱状hcp-Zr和纳米晶体hcp-Zr(Cu)。 Ni注入引起Zr和Zr-Cu的表面非晶化,深度约为100nm。计算出通过Ni注入进行非晶化的临界浓度对于Zr为20at%Ni,对于Zr-Cu膜为6at%Ni。 Zr-Cu非晶化的较低Ni浓度可能归因于混合负热导致Ni与Zr和Cu的化学相互作用。

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