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Impact of heavy boron and antimony doping on COPs and goi

机译:重硼和锑掺杂对COP和Goi的影响

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摘要

The extent to shich crystal originated defect pits called COPs will enhance capacitor B-mode failures has been examined as a function of substrate carrier type and dopant concentration under accumulation and inversion bias modes. In heavily antimony doped samples, the COP density increases with the dopant concentration. However, an unexpected immunity to COPs has been found for n-type capacitors biased into accumulation. This could be readily explained by invoking FowlerNordheim tunneling and the morphology of the capacitor electrodes, as revealed by cross-sectional TEm on simulated COPs formed by KOH anisotropic etching. It is concluded that for wafers with COPs, an enhanced electric field due to small gate electrode curvature contributes to the capacitor breakdown below 8 MV.cm~(-1).
机译:检验了晶体起源的缺陷坑(称为COP)的程度将增强电容器B模式的故障,这是根据衬底载流子类型和累积和反转偏置模式下掺杂剂浓度的函数进行的。在重锑掺杂的样品中,COP密度随掺杂剂浓度的增加而增加。然而,对于偏置为累积的n型电容器,发现了对COP的意外抑制。可以通过调用FowlerNordheim隧穿和电容器电极的形态来容易地解释这一点,如通过KOH各向异性蚀刻形成的模拟COP上的横截面TEm所揭示的。结论是,对于具有COP的晶片,由于栅电极曲率较小而产生的增强电场有助于电容器在8 MV.cm〜(-1)以下击穿。

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