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High Performance InGaZnO_4-based Thin Film Transistors Fabricated at Low Temperature

机译:低温制造的高性能基于InGaZnO_4的薄膜晶体管

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摘要

Thin Film Transistors (TFTs) based on amorphous indium gallium zinc oxide (α-IGZO) were fabricated by RF magnetron sputtering on glass substrates. The TFT device structure was a bottom-gate type, consisting of InZnO as electrodes (gate, source and drain) and two different gate dielectrics (HfO_2 and SiN_x). The resistivities of the a-IGZO films were controlled from 10~(-1) to 10~3 Ω-cm by varying the deposition power, 75W to 300W. TFTs with HfO_2 displayed saturation mobility of~7.2 cm~2V~(-1)s~(-1), threshold voltage of 0.44V, drain current on-to-off ratio of~10~5, and subthreshold gate-voltage swing of~0.25 V.decade~(-1). After 500 hours aging time at room temperature, the threshold voltage for HfO_2-IGZO TFTs shifted in the positive direction, while SiN_x-IGZO TFTs showed almost constant threshold voltage. The IGZO TFTs based on HfO_2 and SiN_x gate dielectrics sputtered near room temperature were found to be good candidates for applications on organic flexible substrates.
机译:通过射频磁控溅射在玻璃基板上制造了基于非晶铟镓锌氧化物(α-IGZO)的薄膜晶体管(TFT)。 TFT器件的结构是底栅型,由InZnO作为电极(栅,源和漏)和两种不同的栅电介质(HfO_2和SiN_x)组成。通过将沉积功率从75W更改为300W,将a-IGZO膜的电阻率控制在10〜(-1)到10〜3Ω-cm。具有HfO_2的TFT的饱和迁移率约为7.2 cm〜2V〜(-1)s〜(-1),阈值电压为0.44V,漏极电流开关比约为10〜5,并且亚阈值栅极电压摆幅〜0.25 V.decade〜(-1)。在室温下老化500小时后,HfO_2-IGZO TFT的阈值电压向正方向移动,而SiN_x-IGZO TFT的阈值电压几乎恒定。发现基于HfO_2和SiN_x栅极电介质的IGZO TFT在室温附近溅射,是在有机柔性基板上应用的良好选择。

著录项

  • 来源
    《Thin Film Transistors 9 (TFT 9)》|2008年|303-308|共6页
  • 会议地点 Honolulu HI(US)
  • 作者单位

    Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, USA;

    Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, USA;

    Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, USA;

    Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, USA;

    Department of Chemical Engineering, University of Florida, Gainesville, FL 32611, USA;

    Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, USA;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 表面处理;
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