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CMOS temperature sensors based on thermal diffusion

机译:基于热扩散的CMOS温度传感器

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This work presents an overview of recent research into integrated temperature sensors based on thermal diffusivity sensing. Such sensors make use of the fact that the thermal diffusivity of highly pure IC-grade silicon has a well-defined temperature dependence and is insensitive to process spread. To measure thermal diffusivity, an on-chip thermal delay can be defined and then used to define the frequency of a VCO. Alternatively, this delay can be directly digitized. Several proof-of-concept devices fabricated in 0.7µm CMOS technology demonstrate good accuracy and reproducibility. They achieve untrimmed inaccuracies in the order of ±0.6°C (3σ) over the military temperature range (−55°C to 125°C), based on the measured performance of 16 samples per batch.
机译:这项工作概述了基于热扩散感测的集成温度传感器的最新研究。这种传感器利用了以下事实:高纯度IC级硅的热扩散率具有明确定义的温度依赖性,并且对过程扩展不敏感。为了测量热扩散率,可以定义片上热延迟,然后将其用于定义VCO的频率。另外,此延迟可以直接数字化。几种采用0.7µm CMOS技术制造的概念验证器件显示出良好的精度和可重复性。基于每批16个样品的实测性能,他们在军用温度范围(-55°C至125°C)中达到了±0.6°C(3σ)的精确度。

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