首页> 外文会议>Symposium on Si Front-End Processing-Physics and Technology of Dopant-Defect Interactions III, Apr 17-19, 2001, San Francisco, California >Determining the Ratio of the Precipitated versus Substituted Arsenic by XAFS and SIMS in Heavy Dose Arsenic Implants in Silicon
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Determining the Ratio of the Precipitated versus Substituted Arsenic by XAFS and SIMS in Heavy Dose Arsenic Implants in Silicon

机译:用XAFS和SIMS测定硅中大剂量砷植入物中沉淀和取代砷的比率

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Doping silicon with arsenic by ion implantation above the solid solubility level leads to As clusters and/or precipitates in the form of monoclinic SiAs causing electrical deactivation of the dopant. Information on the local structure around the As atom, and the As concentration depth profiles is important for the implantation and annealing process in order to reduce the precipitated As and maximize the electrically activated As. In this study, we determined the local As structure and the precipitated versus substituted As for As implants in CZ (001) Si wafers, with implant energies between 20 keV and 100 keV, and implant doses ranging from 1 x 10~(15)/cm~2 to 1 x 10~(18)/cm~2. The samples were subjected to different thermal annealing conditions. We used secondary ion mass spectrometry (SIMS) and UT-MARLOWE simulations to determine the region where the As-concentration is above the solid solubility level. By x-ray absorption fine structure spectroscopy (XAFS), we probed the structure of the local environment around As. XAFS being capable of probing the short-range order in crystalline and amorphous materials provides information on the number, distance and chemical identity of the neighbors of the main absorbing atom. Using Fourier analysis, the coordination numbers (N) and the nearest-neighbor distances (R) to As atoms in the first shell were extracted from the XAFS data. When As precipitates as monoclinic SiAs, the nearest-neighbor distances and coordination numbers are ~2.37 A and ~3, as opposed to ~2.40 A and ~4 when As is substitutional. Based on this information, the critical implant dose where the precipitation/clustering of As starts, and the ratio of the substitutional versus cluster/precipitate form As in the samples were determined.
机译:在固溶度以上通过离子注入对硅掺杂砷会导致As团簇和/或以单斜SiAs形式出现沉淀,从而导致掺杂剂的电钝化。关于As原子周围的局部结构以及As浓度深度分布的信息对于注入和退火过程很重要,以便减少沉淀的As并使电活化的As最大化。在这项研究中,我们确定了CZ(001)Si晶片中As植入物的局部As结构以及沉淀和取代的As植入物,植入能量在20 keV和100 keV之间,且注入剂量为1 x 10〜(15)/ cm〜2至1 x 10〜(18)/ cm〜2样品经受不同的热退火条件。我们使用二次离子质谱(SIMS)和UT-MARLOWE模拟来确定As浓度高于固溶度水平的区域。通过X射线吸收精细结构光谱(XAFS),我们探查了As附近局部环境的结构。 XAFS能够探测晶体和无定形材料中的短程有序,从而提供有关主要吸收原子的邻居的数量,距离和化学特性的信息。使用傅里叶分析,从XAFS数据中提取了第一壳层中与As原子的配位数(N)和最近邻距离(R)。当As沉淀为单斜SiAs时,最接近的距离和配位数为〜2.37 A和〜3,而当As替代时的最近距离和配位数为〜2.40 A和〜4。基于此信息,确定了开始进行As的沉淀/聚簇的关键植入剂量,以及样品中As与簇/沉淀形式的取代形式与As形式的比率。

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