Advanced ELID Process Development for Grinding Silicon Wafers

摘要

A completely new and novel electrolytic system, Injection Electrode (IE) assisted electrolysis, has been tried here to improve the quality of the silicon wafer surfaces generated by Electrolytic In-process Dressing (ELID) grinding process. The Experiments were conducted by varying the injection flow rate in order to perform extensive analysis on the effect of injection flow rate on the generated wheel surface condition and the consequent grinding performance. Experimental results showed that lower injection flow rate greatly improved the wheel surface condition resulting in superior ground surface qualities.