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Void Formation in Hydrogen Implanted and Subsequently Plasma Hydrogenated and Annealed Czochralski Silicon

机译:氢注入,随后等离子体氢化和退火的直拉硅中的空洞形成

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摘要

By μ-Raman spectroscopy the formation of hydrogen related defects (vacancy-hydrogen complexes, hydrogen saturated silicon dangling bonds, H_2 molecules in multi-vacancies and voids/platelets) has been investigated in H-implanted and subsequently H-plasma exposed and annealed Czochralski (Cz) silicon wafers. Annealing was done either in air or in an ambient containing hydrogen (forming gas). The investigations were applied under conditions, which are relevant for ion-cut processes and layer exfoliation in Cz Si for SOI-wafer fabrication at reduced implantation doses (as compared to standard procedures like the smart-cut~® process).
机译:通过μ-拉曼光谱法,已研究了在氢注入后H等离子体暴露并退火的Czochralski中与氢有关的缺陷(空位-氢络合物,氢饱和的硅悬空键,多空位中的H_2分子和空隙/血小板)的形成。 (Cz)硅晶片。退火是在空气中或在含有氢气(形成气体)的环境中进行的。研究是在与离子切割工艺和Cz Si中的层剥离有关的条件下进行的,以便在减少注入剂量的情况下用于SOI晶片制造(与诸如smart-cut〜®工艺的标准程序相比)。

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