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Non-volatile Thin Film Transistors Using Ferroelectric/ITO Structures

机译:使用铁电/ ITO结构的非易失性薄膜晶体管

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摘要

We report ferroelectric-gate thin film transistors (TFTs) using indium tin oxide (ITO) as a channel material. Bottom-gate structure TFTs have been fabricated using ferroelectric Pb(Zr,Ti)O_3 (PZT) film as a gate insulator and ITO channel. Ferroelectric and ITO layers were formed by the sol-gel technique and RF sputtering, respectively. Drain current-drain voltage (I_D-V_D) characteristics of PZT/TTO ferroelectric-gate TFTs exhibit typical n-channel transistor operations with clear current saturation and electrical properties were improved by the post annealing. Drain current-gate voltage (I_D-V_G) characteristics demonstrate clear counterclockwise hysteresis loop due to the ferroelectric gate insulator. The obtained memory window is 2V. The on/off current ratio of more than 10~2 has been obtained, which indicates that the ITO channel is sufficiently depleted by the ferroelectric polarization.
机译:我们报告了使用铟锡氧化物(ITO)作为沟道材料的铁电栅薄膜晶体管(TFT)。已使用铁电体Pb(Zr,Ti)O_3(PZT)膜作为栅极绝缘体和ITO沟道制造了底栅结构TFT。铁电层和ITO层分别通过溶胶-凝胶技术和RF溅射形成。 PZT / TTO铁电栅TFT的漏电流-漏电压(I_D-V_D)特性表现出典型的n沟道晶体管操作,具有明显的电流饱和,并且通过后退火改善了电性能。漏电流栅电压(I_D-V_G)特性表明,由于铁电栅绝缘体,逆时针磁滞回线清晰明了。获得的内存窗口为2V。获得的开/关电流比大于10〜2,表明ITO通道被铁电极化充分耗尽。

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