首页> 外文会议>Symposium Proceedings vol.811; Symposium on Integration of Advanced Micro- and Nanoelectronic Devices - Critical Issues and Solutions; 20040413-16; San Francisco,CA(US) >Effect of different annealing procedures on the microstructure and the electrical properties of CSD derived (Ba,Sr)TiO_3 thin films
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Effect of different annealing procedures on the microstructure and the electrical properties of CSD derived (Ba,Sr)TiO_3 thin films

机译:不同退火工艺对CSD衍生(Ba,Sr)TiO_3薄膜微观结构和电学性能的影响

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摘要

Processing of BST thin films is becoming more and more important for microwave electronics and for its probable incorporation in future high density DRAM's. A co-relation between processing and final device characteristics is of utmost importance. Differences in microstructure and electrical properties were observed when chemical solution deposited thin films were annealed using a conventional diffusion furnace, rapid thermal annealing furnace with different heating ramps, and a hot plate for pyrolysis prior crystallization. The solution was made with the propionate route and then deposited on Pt coated silicon wafers. Cross-sectional SEM's were performed on the different films. It was found that the microstructure depended on the annealing method of the film. The electrical properties of the films were also found to vary considerably. Frequency dependence of the dielectric constant was studied. The leakage study on different films was performed at different temperatures.
机译:BST薄膜的加工对于微波电子及其可能结合到未来的高密度DRAM中变得越来越重要。处理与最终设备特性之间的相互关系至关重要。当使用常规扩散炉,具有不同加热斜率的快速热退火炉和在结晶前进行热解的热板对化学溶液沉积的薄膜进行退火时,观察到微观结构和电性能的差异。用丙酸途径制备溶液,然后将其沉积在涂有Pt的硅晶片上。在不同的膜上进行横截面SEM。已经发现,微观结构取决于膜的退火方法。还发现薄膜的电性能有很大的不同。研究了介电常数的频率依赖性。在不同温度下对不同薄膜进行泄漏研究。

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