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Power limitation due to premature breakdown in alGaN/GaN HFETs

机译:由于alGaN / GaN HFET的过早击穿而导致的功率限制

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摘要

A systematic investigation of high field prebrakdown and breakdown phenomena of AlGaN/GaN Heterojunction Field Effect Tranistors (HFETs) is presented. The breakdown process was studied as a function of various parameters such as applied electric field, material layer structure, semiconductor surface conditions, ambient dielectric, and test conditions. Experimental evidence of a breakdown mechanism, distinct form the bulk/subsurface breakdown, namely on-surface breakdown or surface flashover is presented. A presented. A practical, unambiguous way of identifying device failure by surface flashover is proposed. Surface flashover between gate and drain contact edges is proosed as the main mechanism initiating premature breakdown in thse devices leading to a significant reduction of their power capability.
机译:提出了高场预击穿和AlGaN / GaN异质结场效应晶体管(HFET)的击穿现象的系统研究。研究了击穿过程与各种参数的关系,例如施加的电场,材料层结构,半导体表面条件,环境电介质和测试条件。提出了一种分解机理的实验证据,其形式不同于块体/地下分解,即表面分解或表面闪络。一个提出。提出了一种通过表面闪络识别设备故障的实用,明确的方法。栅极和漏极接触边缘之间的表面飞弧被认为是引发这些器件过早击穿的主要机制,从而导致其功率能力显着降低。

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