首页> 外文会议>Symposium on Microcrystalline and Nanocrystalline Semiconductors-2000 Nov 27-30, 2000, Boston, Massachusetts, U.S.A. >Self-Formation of Au Microwires on Au-Covered Si Electrode Surface by Electrochemical Etching in Dilute Hydrofluoric Acid Solution
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Self-Formation of Au Microwires on Au-Covered Si Electrode Surface by Electrochemical Etching in Dilute Hydrofluoric Acid Solution

机译:稀氢氟酸溶液中电化学刻蚀在含金硅电极表面上自行形成金微丝

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摘要

We have investigated the method of fabricating microstructures on a Si surface that is covered with a patterned gold (Au) mask, by electrochemical etching (anodization) in dilute hydrofluoric acid (HF) solution. We found that at electrode potentials below approximately 0.5 V, the Si surface is preferentially etched on the fringe of the Au mask, where a number of pores are formed. At higher electrode potentials, Au microwires with about 1μm in width form along the fringe of the Au mask overlayer. We suggest that electromigration of Au towards the fringe of the Au mask induces self-assembling of Au atoms to form microwires. The observed self-formation of metal microwires would be beneficial to the fabrication of metal micro- or nano-structures on Si.
机译:我们研究了在稀氢氟酸(HF)溶液中通过电化学蚀刻(阳极氧化)在覆盖有图案化金(Au)掩模的Si表面上制造微结构的方法。我们发现,在低于约0.5 V的电极电势下,Si表面优先在Au掩模的边缘蚀刻,在该处形成了许多孔。在较高的电极电势下,沿Au掩膜上覆层的边缘形成宽度约1μm的Au微线。我们建议Au向Au掩模的边缘电迁移会诱导Au原子自组装形成微线。观察到的金属微丝的自形成将有利于在Si上制造金属微结构或纳米结构。

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