首页> 外文会议>Symposium F,"Nanocrystalline and Microcrystalline Semiconductor Materials and Structures" >Self-Formation of Au Microwires on Au-Covered Si Electrode Surface by Electrochemical Etching in Dilute Hydrofluoric Acid Solution
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Self-Formation of Au Microwires on Au-Covered Si Electrode Surface by Electrochemical Etching in Dilute Hydrofluoric Acid Solution

机译:稀氢氟酸溶液中的电化学蚀刻通过电化学蚀刻在Au覆盖Si电极表面上的自体形成

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We have investigated the method of fabricating microstructures on a Si surface that is covered with a patterned gold (Au) mask, by electrochemical etching (anodization) in dilute hydrofluoric acid (HF) solution. We found that at electrode potentials below approximately 0.5 V, the Si surface is preferentially etched on the fringe of the Au mask, where a number of pores are formed. At higher electrode potentials, Au microwires with about 1μm in width form along the fringe of the Au mask overlayer. We suggest that electromigration of Au towards the fringe of the Au mask induces self-assembling of Au atoms to form microwires. The observed self-formation of metal microwires would be beneficial to the fabrication of metal micro- or nano-structures on Si.
机译:我们研究了通过稀氢氟酸(HF)溶液中的电化学蚀刻(阳极氧化)在覆盖着图案化金(Au)掩模的Si表面上制造微结构的方法。我们发现,在大约0.5V的电极电位下,优先在Au掩模的边缘上蚀刻Si表面,其中形成了多个孔。在更高的电极电位下,沿着Au掩模覆盖层的条纹的宽度形状的宽度形状的Au微线。我们建议使用Au朝向Au掩模的边缘的电迁移诱导Au原子的自组装形成微线。观察到的金属微射线的自我形成是有利于在Si上制造金属微粒或纳米结构的制造。

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