首页> 外文会议>Symposium on Compound Semiconductor Surface Passivation and Novel Device Processing held April 5-7, 1999, San Francisco, California,U.S.A. >In situ surface passivation of gaas by thermal nitridation using metalorganic vapor phase epitaxy
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In situ surface passivation of gaas by thermal nitridation using metalorganic vapor phase epitaxy

机译:金属有机气相外延通过热氮化对gaas进行原位表面钝化

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摘要

An ammonia-based, in situ passivation of GaAs surfaces conducted within a metalorganic vapor phase epitaxy reactor is present. The shift of the GaAs surface Fermi level, and hence the surface charge density, resulting from this in situ passivation, has been studied using photoreflectance (PR) spectroscopy. Samples consisting of an undoped GaAs layer on highly doped n-GaAs (UN~+) and p-GaAs (UP~+) structures allow for the exact determination of the surface Fermit level position using PR. These structures were grown by MOVPE and in situ thermal nitridation was performed after growth withint he MOVPE system without exposure to the air. After nitridation, the surface Fermi level can be shifted by approx 0.23 eV towards the conduction band edge for UN~+ structures and by approx 0.11 eV towards the valence band edge for UP~+ structures from the normally mid-gap 'pinned' positions.
机译:存在在金属有机气相外延反应器内进行的基于氨的GaAs表面原位钝化。已经使用光反射(PR)光谱研究了GaAs表面费米能级的移动,以及由此原位钝化产生的表面电荷密度。由高掺杂n-GaAs(UN〜+)和p-GaAs(UP〜+)结构上的未掺杂GaAs层组成的样品可以使用PR精确确定表面Fermit能级位置。这些结构通过MOVPE进行生长,并且在MOVPE系统内生长且未暴露于空气后进行原位热氮化。氮化后,对于UN〜+结构,表面费米能级朝着导带边缘偏移约0.23 eV;对于UP〜+结构,从正常的中间间隙“钉扎”位置朝着价带边缘偏移约0.11 eV。

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