【24h】

Plasma etching conditioning of textured crystalline silicon surfaces for a-Si/c-Si heterojunctions

机译:用于a-Si / c-Si异质结的等离子刻蚀处理带纹理的晶体硅表面

获取原文
获取原文并翻译 | 示例

摘要

The development of a hybrid heterojunction fabricated by growing ultrathin amorphous silicon by Plasma Enhanced Chemical Vapor Deposition using temperature below 250 deg C offers the potential of obtaining high efficiency solar cells deposited on glassy substrates. The surface preparation represents one of the most critical steps. The first aim of etching is to remove the native oxide layer from the surface of the crystalline wafer, before amorphous layer deposition. The possibility of obtaining this goal with a dry procedure that reduces the exposure of the sample to the environment is not trivial.
机译:通过在低于250摄氏度的温度下通过等离子增强化学气相沉积法生长超薄非晶硅而制造的混合异质结的开发,提供了获得沉积在玻璃状基板上的高效太阳能电池的潜力。表面处理代表了最关键的步骤之一。蚀刻的第一个目的是在非晶层沉积之前从晶体晶片的表面去除自然氧化层。用干燥的方法来减少样品暴露于环境中的目的来达到这个目标的可能性并不小。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号