A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates

摘要

Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.