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Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

机译：校正：聚酰亚胺膜和铜层粘合强度老化效应的研究

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Seok-Bon Koo; Chang-Myeon Lee; Sang-Jun Kwon; Jun-Mi Jeon; Jin-young Hur; Hong-Kee Lee;
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1. Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer (vol 25, pg 117, 2019) [J] . Koo Seok-Bon, Lee Chang-Myeon, Kwon Sang-Jun, Metals and Materials International . 2019,第3期

机译：聚酰亚胺膜和铜层粘合强度的老化效应研究（Vol 25，PG 117,2019）
2. Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer [J] . Koo Seok-Bon, Lee Chang-Myeon, Kwon Sang-Jun, Metals and Materials International . 2019,第1期

机译：聚酰亚胺膜和铜层粘合强度老化效应研究
3. Study of Adhesion Strength of Electroplated Copper to Polyimide Using Different Types of Tie Layers [J] . Chen Lin, Liao Bin, Yu Jingjing, Nanoscience and Nanotechnology Letters . 2015,第3期

机译：使用不同类型的粘结层研究电镀铜对聚酰亚胺的粘结强度
4. A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates [C] . Y.M. Chung, W.S. Jung, C.S. Moon, Society of Vacuum Coaters Annual Technical Conference; 20050423-28; Denver,CO(US) . 2005

机译：高能离子流合成界面层效应对铜薄膜与聚酰亚胺基体粘结强度下降的影响
5. A study of the etching and surface modification characteristics of polyimide films for use as a dielectric layer in multi-chip modules. [D] . Mannarino, Matthew Marchand. 2008

机译：对用作多芯片模块介电层的聚酰亚胺薄膜的蚀刻和表面改性特性的研究。
6. Improved electro-mechanical performance of gold films on polyimide without adhesion layers [O] . Barbara Putz, Rachel L. Schoeppner, Oleksandr Glushko, -1

机译：改善了不带粘合层的聚酰亚胺上金膜的机电性能
7. Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films [O] . Ho-Nyun Lee, Yoonsung Han, Jang-hun Lee, 2013

机译：无电镀铜与聚酰亚胺薄膜粘合强度的老化影响
8. Adhesion Enhancement of Thin Copper Film on Polyimide Modified by Oxygen ReactiveIon Beam Etching [R] . Paik, K. W., Ruoff, A. L. 1990

机译：添加到阅览室阅读软件下载与<<氧反应离子束蚀刻改性聚酰亚胺薄膜的增粘作用>>相似的文献

Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

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