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Experiment and Device Simulation for Photo-Electron Overflow Characteristics on a Pixel-Shared CMOS Image Sensor Using Lateral Overflow Gate

机译:使用横向溢流门的像素共享CMOS图像传感器上的光电溢流特性的实验和设备仿真

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A wide dynamic range CMOS image sensor with lateral overflow integration capacitor sharing two pixels by using lateral overflow gate (LO-gate) which directly connect the photodiode and the overflow photoelectron integration capacitor (Cs) has been developed. In this paper, the characteristics of the saturated-photoelectrons overflowing to the floating diffusion (FD) and to the Cs have been discussed through the comparison of the results of experiments and device simulations. It is possible to integrate all the saturated photoelectrons in the Cs without leaking to the shared FD by controlling the voltages of the gate electrodes of the transfer transistor and the LO-gate in the pixel which strong light irradiates. The CMOS image sensor consisting of 1/3.3 inch optical format, 3 μm pixel pitch and 1280~(H) × 960~(V) pixels was fabricated by a 0.18 μm 2P3M CMOS technology with a buried pinned photodiode process and has achieved 84 μV/e~- photo-electric conversion gain, 6.9 × 10~4 e~- full well capacity and 90 dB dynamic range in one exposure.
机译:通过使用直接连接光电二极管和溢出光电子积分电容器(Cs)的横向溢出门(LO-gate),开发了具有横向溢出积分电容器共享两个像素的宽动态范围CMOS图像传感器。通过比较实验结果和器件仿真,讨论了饱和光电子溢出到浮动扩散区(FD)和Cs的特性。通过控制强光照射的像素中的传输晶体管的栅极电极和LO栅极的电压,可以将所有饱和光电子积分到Cs中而不泄漏到共享的FD。 CMOS图像传感器由0.13μm2P3M CMOS技术通过掩埋固定光电二极管工艺制成,由1 / 3.3英寸光学格式,3μm像素间距和1280〜(H)×960〜(V)像素组成,现已达到84μV / e〜-光电转换增益,6.9×10〜4 e〜-的全阱容量和一次曝光的90 dB动态范围。

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